Dianhydrides & Imides

Description

Specialty dianhydrides can be used as an epoxy curing agent or as building blocks for polyimides. It is available in multiple purity levels and as a powder or flake.

Benefits

Incorporating BISDA into polyimide formulations may provide enhanced performance in heat resistance, flexibility/softness, dimensional stability and metal adhesion properties.

In epoxy systems, BISDA as a curing agent may offer improved thermal performance, increased pot life, easier handling, improved chemical resistance, better toughness, lower dielectric properties, lower shrinkage and lower moisture absorption.

Reactive Polyetherimide oligomers can be used as a high temperature toughening agent for thermosetting systems in composites, adhesives, and coatings. Provides enhanced processability while improving toughness-stiffness balance, high heat, lower moisture absorption, and excellent FST performance.