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LNP™ FARADEX™ Compound MS003

LNP* FARADEX* MS003 is a compound based on Polypropylene resin containing 15% Stainless Steel. Added features of this material include: Electrically Conductive, EMI/RFI Shielding.

LNP™ STAT-KON™ Compound MX01767C

LNP STAT-KON MX01767C is a compound based on Polypropylene containing Proprietary Filler(s). Added features of this grade include: Electrically Conductive, Clean Compounding Syst...

LNP™ STAT-KON™ Compound MD000

LNP STAT-KON* MD000 is a compound based on Polypropylene resin containing Carbon Powder. Added feature of this material is: Electrically Conductive.

LNP™ STAT-KON™ Compound MD000IS

LNP STAT-KON* MD000IS is a compound based on Polypropylene resin containing Carbon Powder. Added features of this material include: Electrically Conductive, High Impact.

LNP™ STAT-KON™ Compound MD000ISC

LNP STAT-KON* MD000ISC is a compound based on Polypropylene resin containing Carbon Powder. Added features of this material include: Electrically Conductive, High Impact.

LNP™ STAT-KON™ Compound ME003S

LNP STAT-KON ME003S is a compound based on Polypropylene resin containing 15% Carbon Fiber. Added features of this material include: Electrically Conductive, Heat Stabilized.

LNP™ STAT-KON™ Compound ME006

LNP STAT-KON* ME006 is a compound based on Polypropylene resin containing 30% Carbon Fiber. Added features of this material include: Electrically Conductive.

LNP™ COLORCOMP™ Compound M1000

LNP COLORCOMP M1000 is an unfilled Polypropylene resin.

LNP™ THERMOCOMP™ Compound MFB41I

LNP* Thermocomp* MFB41I is a compound based on Polypropylene resin containing Glass Fiber, Glass Bead. Added features include: Chemically Coupled

LNP™ THERMOCOMP™ Compound MFB22S

LNP THERMOCOMP MFB22S is a compound based on Polypropylene containing 10% Glass Fiber, 10% Glass Bead. Added feature of this grade is: Heat Stabilized.