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LNP™ THERMOCOMP™ Compound GF004

LNP THERMOCOMP GF004 is a compound based on Polysulfone resin containing 20% Glass Fiber.

LNP™ THERMOCOMP™ Compound DX07408

LNP THERMOCOMP DX07408 is a compound based on Polycarbonate containing Proprietary Filler(s). Added feature of this grade is: UL Rated.

LNP™ THERMOCOMP™ Compound HB006

LNP THERMOCOMP HB006 is a compound based on Nylon 11 resin containing 30% Glass Bead.

LNP™ THERMOCOMP™ Compound 2F004

LNP FP-EF-1004 is a fluoropolymer compound based on ETFE resin containing 20% Glass Fiber.

LNP™ THERMOCOMP™ Compound 2F005

LNP THERMOCOMP 2F005 is a fluoropolymer compound based on ETFE containing 25% Glass Fiber.

LNP™ THERMOCOMP™ Compound RC008ESS

LNP THERMOCOMP RC008ESS is a compound based on PA66 resin containing Carbon Fiber. Added features include; Electrically Conductive, Easy Molding, Heat Stabilized.

LNP™ THERMOCOMP™ Compound RC008H

LNP THERMOCOMP* RC008H is a compound based on Nylon 66 resin containing 40% Carbon Fiber. Added features of this material include: Electrically Conductive, Healthcare.

LNP™ THERMOCOMP™ Compound RF002

LNP THERMOCOMP* RF002 is a compound based on Nylon 66 resin containing 10% Glass Fiber.

LNP™ THERMOCOMP™ Compound RC00A

LNP THERMOCOMP RC00A is a compound based on PA6.6 resin containing Carbon Fiber. Added features include: Electrically Conductive

LNP™ THERMOCOMP™ Compound RC008

LNP THERMOCOMP* RC008 is a compound based on Nylon 66 resin containing 40% Carbon Fiber. Added features of this material include: Electrically Conductive.