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LNP™ THERMOCOMP™ Compound 2C003

LNP THERMOCOMP 2C003 is a compound based on ETFE resin containing 15% Carbon Fiber. Added features of this material include: Electrically Conductive.

LNP™ THERMOCOMP™ Compound 2C004

LNP THERMOCOMP 2C004 is a compound based on ETFE resin containing 20% Carbon Fiber. Added features of this material include: Electrically Conductive.

LNP™ THERMOCOMP™ Compound 2X04505

LNP THERMOCOMP 2X04505 is a compound based on ETFE resin containing Proprietary Filler(s).

LNP™ THERMOCOMP™ Compound 2X95787

LNP THERMOCOMP 2X95787 is a compound based on ETFE Copolymer resin containing Proprietary Filler(s).

LNP™ THERMOCOMP™ Compound PCAF04FRHH

LNP* THERMOCOMP* PCA04FRHH is a 20 % glass reinforced PC+ABS blend without chlorinated or brominated flame retardants. LNP* THERMOCOMP* complies with the material requirements as s...

LNP™ THERMOCOMP™ AM Compound DC004XXA11

LNP THERMOCOMP AM DC004XXA11is a compound based on High Heat PC resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications, including mid-tempera...

LNP™ THERMOCOMP™ AM Compound EC004EXAR1

LNP THERMOCOMP EC004EXAR1 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber designed to provide a Wider Process Window and Easier Flow for Large Format Ad...

LNP™ THERMOCOMP™ AM Compound JC004XXAR1

LNP THERMOCOMP AM JC004XXAR1 is a compound based on PESU (Polyethersulfone) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing an...

LNP™ THERMOCOMP™ AM Compound 6C004XXAR1

LNP THERMOCOMP 6C004XXAR1 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) ...

LNP™ THERMOCOMP™ Compound HB006

LNP THERMOCOMP HB006 is a compound based on Nylon 11 resin containing 30% Glass Bead.