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Description
The product family of THERMOCOMP™ AM compounds for pellet-fed additive manufacturing is based on amorphous resins such as ABS, PPE, PC and PEI. The compounds exhibit good creep behavior versus semi-crystalline resins, and reduced deformation under constant pressure. Further, lower shrinkage during cooling means these materials demonstrate greater dimensional stability and less thermal expansion during part use.
等级
适用等级： 8 （清除筛选）
LNP THERMOCOMP AC004XXAR1 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Easy Processing, Low warp and Good Print Surface quality, making them a good candidate material for a broad range of applications and tooling, including thermoforming and vacuum-forming. LNP™ THERMOCOMP™ AM, grade name AC004XXAR1, is a compound based on ABS resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. ABS based compounds provide easy processing, low warp and good print surface quality, making them a good candidate material for a broad range of applications and tooling, including thermoforming and vacuum-forming. EuropeAsiaAmericas
LNP THERMOCOMP AF004XXAR1 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Easy Processing, Low Warp and Good Print Surface quality, making them a good candidate material for a broad range of applications and tooling, including thermoforming and vacuum-forming. LNP™ THERMOCOMP™ AM, grade name AF004XXAR1, is a compound based on ABS resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. ABS based compounds provide easy processing, low warp and good print surface quality, making them a good candidate material for a broad range of applications and tooling, including thermoforming and vacuum-forming. EuropeAsiaAmericas
LNP THERMOCOMP DC004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish. LNP™ THERMOCOMP™ AM, grade name DC004XXAR1, is a compound based on PC resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PC based compounds deliver higher strength, higher temperature performance and higher throughput compared to ABS and PPE, as well as excellent ductility and smooth surface finish Americas
LNP THERMOCOMP DF004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish. LNP™ THERMOCOMP™ AM, grade name DF004XXAR1, is a compound based on PC resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. PC based compounds deliver higher strength, higher temperature performance and higher throughput compared to ABS and PPE, as well as excellent ductility and smooth surface finish. EuropeAsiaAmericas
LNP THERMOCOMP EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep. LNP™ THERMOCOMP™ AM, grade name EC004XXAR1, is a compound based on PEI resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep EuropeAsiaAmericas
LNP THERMOCOMP EF004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep. LNP™ THERMOCOMP™ AM, grade name EF004XXAR1, is a compound based on PEI resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PEI compounds, based on SABIC's inherently flame-retardant ULTEM(TM) resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep. EuropeAsiaAmericas
LNP THERMOCOMP ZC004XXAR1 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Lower Thermal Expansion, Improved Hydrolytic Stability, Higher strength to Weight Ratio, Higher Temperature Performance and improved processing vs. ABS based grades. LNP™ THERMOCOMP™ AM, grade name ZC004XXAR1, is a compound based on PPE resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PPE compounds offer lower thermal expansion, improved hydrolytic stability, higher strength to weight ratio and higher temperature performance and improved processing vs ABS based grades EuropeAsiaAmericas
LNP THERMOCOMP ZF004XXAR1 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Lower Thermal Expansion, Improved Hydrolytic Stability, Higher Strength to Weight Ratio and Higher Temperature Performance vs. ABS. LNP™ THERMOCOMP™ AM, grade name ZF004XXAR1, is a compound based on PPE resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PPE based compounds offers lower thermal expansion, improved hydrolytic stability, higher strength to weight ratio and higher temperature performance compared to ABS EuropeAsiaAmericas