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LNP™ THERMOCOMP™ Compound MF004ALS

LNP THERMOCOMP MF004ALS compound is based on Polypropylene (PP) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized, Low Extractables and Food C...

HAPSOFT™ S3615

HAPSOFT™ PPcompound (PPc) S3615 is a 15% short glass fiber reinforced polypropylene copolymer compound for injection moulding applications. The compound is UV stabilized and the g...

HAPSOFT™ S3620

HAPSOFT™ PPcompound (PPc) S3620 is a 20% short glass fiber reinforced polypropylene copolymer compound for injection moulding applications. The compound is UV stabilized and the gl...

HAPSOFT™ S3625

HAPSOFT™ PPcompound (PPc) S3625 is a 25% short glass fiber reinforced polypropylene copolymer compound for injection moulding applications. The compound is UV stabilized and the gl...

LNP™ THERMOCOMP™ Compound MX05484

LNP THERMOCOMP MX05484 compound is based on Polypropylene (PP) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.

LNP™ COLORCOMP™ Compound MX05486

LNP COLORCOMP MX05486 compound is based on Polypropylene (PP) resin. Added features of this grade include: Low Extractables.

LNP™ STAT-LOY™ Compound M3000C

LNP STAT-LOY M3000C compound is based on unfilled Polypropylene (PP) resin containing proprietary fillers. Added features of this grade include: LNP Clean Compounding Technology, P...

LNP™ COLORCOMP™ Compound M1000S

LNP COLORCOMP M1000S compound is based on Polypropylene (PP) resin. Added features of this grade include: Heat Stabilised.

LNP™ STAT-LOY™ Compound M3000

LNP STAT-LOY M3000 compound is based on unfilled Polypropylene (PP) resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.

LNP™ THERMOCOMP™ Compound MC004

LNP THERMOCOMP MC004 compound is based on Polypropylene (PP) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.