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19 results found
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LNP™ THERMOCOMP™ Compound AX04518
LNP THERMOCOMP AX04518 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber.
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LNP™ THERMOCOMP™ AM Compound DC004XXA11
LNP THERMOCOMP AM DC004XXA11is a compound based on High Heat PC resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications, including mid-tempera...
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LNP™ THERMOCOMP™ AM Compound JC004XXAR1
LNP THERMOCOMP AM JC004XXAR1 is a compound based on PESU (Polyethersulfone) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing an...
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LNP™ THERMOCOMP™ AM Compound DC0041XA51
LNP THERMOCOMP DC0041XA51 compound is based on PC Copolymer Resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this gr...
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LNP™ THERMOCOMP™ AM Compound EC004EXAR1
LNP THERMOCOMP EC004EXAR1 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber designed to provide a Wider Process Window and Easier Flow for Large Format Ad...
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LNP™ THERMOCOMP™ AM Compound 6C004XXAR1
LNP THERMOCOMP 6C004XXAR1 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) ...
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LNP™ THERMOCOMP™ AM Compound EC004XXAR1
LNP THERMOCOMP EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher s...
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LNP™ THERMOCOMP™ AM Compound AC004XXAR1
LNP THERMOCOMP AC004XXAR1 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. ...
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LNP™ THERMOCOMP™ AM Compound EF004XXAR1
LNP THERMOCOMP EF004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PEI compounds, b...
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LNP™ THERMOCOMP™ AM Compound EZ006EXAR1
LNP THERMOCOMP EZ006EXAR1is a compound based on Polyetherimide (PEI) resin containing 30% milled glass fiber for Large Format Additive manufacturing (LFAM) applications requiring b...