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Home > Products > Specialties > ADDITIVE MANUFACTURING > LNP™ THERMOCOMP™ AM Compound

LNP™ THERMOCOMP™ AM Compound

  • Grades Available: 14
  • Available in: Europe, Asia, Americas
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LNP™ THERMOCOMP™ AM Compound

General Information

Description

The product family of THERMOCOMP™ AM compounds for large format additive manufacturing is based on amorphous resins such as ABS, PPE, PC and PEI. The compounds exhibit good creep behavior versus semi-crystalline resins, and reduced deformation under constant pressure. Further, lower shrinkage during cooling means these materials demonstrate greater dimensional stability and less thermal expansion during part use.

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Associated Documents

Large Format Additive Manufacturing Brochure

English, Published 17-10-2017

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