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504 results found
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LNP™ THERMOCOMP™ Compound D351
LNP THERMOCOMP D351 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-B...
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LNP™ THERMOCOMP™ Compound AR002XXH
LNP THERMOCOMP AR002XXH compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% Barium Sulfate. Added features of this grade include: Healthcare.
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LNP™ THERMOCOMP™ Compound DC006
LNP THERMOCOMP DC006 compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound DC006ER
LNP THERMOCOMP DC006ER compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Mold Release, Electrically Con...
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LNP™ THERMOCOMP™ Compound DC006ERH
LNP THERMOCOMP DC006ERH compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Mold...
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LNP™ THERMOCOMP™ Compound AW00A
LNP THERMOCOMP AW00A compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing wollastonite.
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LNP™ THERMOCOMP™ Compound 9X11428J
LNP THERMOCOMP 9X11428J compound is based on Polyphenylsulfone (PPSU) containing proprietary filler. Added features of this grade include: Healthcare, Low Extractables, Food Contac...
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LNP™ THERMOCOMP™ Compound 9X99089
LNP THERMOCOMP 9X99089 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound AB002
LNP THERMOCOMP AB002 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% glass bead.
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LNP™ THERMOCOMP™ Compound AC004
LNP THERMOCOMP AC004 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.