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LNP™ THERMOCOMP™ Compound ZX06323

LNP THERMOCOMP ZX06323 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary fillers. Added features of this grade include: High Dielectric C...

LNP™ THERMOCOMP™ Compound FX10009

LNP THERMOCOMP FX10009 compound is based on Polyethylene (PE) resin containing proprietary fillers. Added features of this grade include: Improved Dielectric Properties.

LNP™ THERMOCOMP™ Compound DX13354X

LNP THERMOCOMP DX13354X compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Perf...

LNP™ THERMOCOMP™ Compound 2Z004

LNP THERMOCOMP 2Z004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% milled glass.

LNP™ THERMOCOMP™ Compound DC004E

LNP THERMOCOMP DC004E compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP™ THERMOCOMP™ Compound D451

LNP THERMOCOMP D451 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-B...

LNP™ THERMOCOMP™ Compound D452

LNP THERMOCOMP D452 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-B...

LNP™ THERMOCOMP™ Compound D551

LNP THERMOCOMP D551 compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-B...

LNP™ THERMOCOMP™ Compound DF008

LNP THERMOCOMP DF008 compound is based on Polycarbonate (PC) resin containing 40% glass fiber.

LNP™ THERMOCOMP™ Compound DC0041PQ

LNP THERMOCOMP DC0041PQ compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Non-Brominated, No...