Search
Fiber optic connectors and components
Changes in data center and external architectures are expected to significantly impact connector design and material selection. From densification to rapid deployment, and from weathering harsh environments to providing maximum uptime, designing with materials that can adapt and perform across multiple environmental conditions has become increasing more important.
Plug-in, on-board, co-packaged optics
ULTEM™ resins have been used for decades to produce near-IR transparent lenses in fiber optic connectors, pluggable optical transceivers, and sensors. Co-packaged optics are a next-generation technology that can help increase data center bandwidth and reduce power consumption and costs by bringing the optical connection much closer to the main switching ASIC. EXTEM™ RH1017UCL resin addresses these needs as it allows optical engineers the design freedom of injection molding but also the assembly efficiency enabled by having multiple solder reflow capability.
Key properties
- Dimensional stability, high flow, colorability
- Weatherability, UV and chemical resistance
- Reflow soldering capability (Tg = 260°C)
- Near-IR transparency, dimensional stability
- ISCC+ Certified renewable made with bio-based feedstocks
Related products
Related content
Fiber Optic Connectors for AI, 5G
Photonics and CoPackaged Optics